32 GB (2x 16 GB), DDR5, 6000 MHz, CL 30-40-40, RGB

Key Features

• Compact Low-Profile Heatsink Design
• Customizable RGB light effects
• Create Personalized Lightshow with XPG Prime
• PMIC for power supply stability
• On-die ECC error correction
• High-quality materials for stable overclocking
• Supports Intel® XMP 3.0 and AMD EXPO for easy overclocking

Description

Compact Low-Profile Heatsink Design
The LANCER BLADE RGB boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interfering with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.

RGB Your Way
Set the RGB lighting the way you want it. Choose from different effects (static, breathing, and comet) or sync the lights with your favorite jams via Music Mode. All this can be done through RGB control software from all the major motherboard brands.

Create Personalized Lightshow with XPG Prime
XPG Prime lighting control software not only allows you to set unique DRAM lighting effects, you can also sync all Prime supported XPG RGB products to create imaginative light shows and shape your own Prime ecosystem.

Enhanced Power Management
The XPG LANCER BLADE RGB DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.

Stability and Reliability
With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.

Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.

AMD EXPO
Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.

Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.

Specifications

Memory
Package type	Tray
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	30
Memory clock speed	6000 MHz
Internal memory type	DDR5
Design
Backlight colour	Multicolour
Backlight	Yes
Cooling type	Heatsink
Technical details
Cooling type	Heatsink
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight colour	Multicolour
Backlight	Yes
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	30
Cooling type	Heatsink
Memory clock speed	6000 MHz
Internal memory type	DDR5
AMD Extended Profiles for Overclocking (EXPO)	Yes
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-20 - 65 °C
Weight & dimensions
Package width	141 mm
Package depth	170 mm
Package height	12.2 mm
Width	40 mm
Depth	133.3 mm
Height	7.86 mm
Weight	41.11 g
Package type	Tray
Package weight	122.91 g
Packaging data
Package width	141 mm
Package depth	170 mm
Package height	12.2 mm
Package type	Tray
Package weight	122.91 g