Supermicro 4U Active CPU Heat Sink Socket LGA4677 (SNK-P0090AP4)

Key Features

• 4U Passive CPU Heat Sink
• For 4th Generation Intel® Xeon® Scalable Processors
• Socket LGA4677-1/E1
• Supermicro Certified

Description

This CPU heat sink is designed for certain Supermicro X13 generation systems equipped with 4th Generation Intel® Xeon® Scalable Processors. The heat sink has been fully tested and validated by Supermicro to ensure the best quality and cooling performance.

Specifications

Performance
Suitable location	Processor
Pulse-width modulation (PWM) support	Yes
Thermal Design Power (TDP)	350 W
Type	Heatsink/Radiator
Supported processor sockets	LGA 4677 (Socket E)
Compatible processor series	Intel® Xeon®
Mean time between failures (MTBF)	121.457 h
Fan's mean time to failure (MTTF)	121.457 h
Design
Product colour	Grey
Technical details
Thermal Design Power (TDP)	350 W
Type	Heatsink/Radiator
Supported processor sockets	LGA 4677 (Socket E)
Compatible processor series	Intel® Xeon®
Compliance certificates	REACH, RoHS
Power
Rated voltage	12 V
Thermal Design Power (TDP)	350 W
Colour
Product colour	Grey
Weight & dimensions
Fan dimensions (W x D x H)	92 x 25 x 92 mm
Endurance
Mean time between failures (MTBF)	121.457 h